灌注封裝膠 Encapsulants & PottingProducts
灌注封裝膠的設計用意是使用在電子產品內用於保護主機板上的精細元件等，灌注後的保護機制需要保護產品防範以下幾種狀況:機械衝擊，高溫衝擊，震動，化學物質侵蝕，潮濕，極端溫度和長時間受熱等。灌注封裝膠的應用面除了用於保護外，同時還可用於導熱和光屏蔽。ACC的灌注封裝膠擁有以下幾種特質: 操作溫度範圍可達-115 to +300ºC 、高電阻特質 、具彈性 、廣泛硬度範圍(軟-超硬)、抗UV、耐化學物質侵蝕、抗水防潮、簡單使用、抑制菌原生長。
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- EGEL3000
- 2-PART SILICONE GEL LOW VISCOSITY
- EGEL3002
- 2 PART SILICONE GEL FAST CURE
- EGEL3003
- 2 PART SILICONE GEL LOW VISCOSITY SOFT
- EGEL3004
- 2 PART SILICONE GEL THIXOTROPIC
- EGEL3005
- 2 PART SILICONE GEL LOW VISCOSITY
- EGEL3100
- SILCOTHERM 2 PART SILICONE GEL
- QGEL330
- SILICONE GEL TOUGH HIGH PURITY
- QGEL331
- SILICONE GEL FLAME RETARDANT UL APPROVED
- QLE1102
- 2 PART SILICONE ENCAPSULANT OPTICALLY CLEAR
- QSIL12
- 20:1 CONDENSATION CURE SILICONE ENCAPSULANT CLEAR
- QSIL216
- 10:1 ADDITION CURE SILICONE ENCAPSULANT OPTICALLY CLEAR
- QSIL218
- 10:1 ADDITION CURE SILICONE ENCAPSULANT OPTICALLY CLEAR
- QSIL222
- 10:1 ADDITION CURE SILICONE ENCAPSULANT OPTICALLY CLEAR
- QSIL229
- 1:1 ADDITION CURE SILICONE ENCAPSULANT OPTICALLY CLEAR
- QSIL550
- 2-PART ADDITION CURE ENCAPSULANT
- QSIL556
- 2 PART ADDITION CURE SILICONE ENCAPSULANT
- QSIL573
- SILCOTHERM 2 PART ADDITION CURE SILICONE ENCAPSULANT
- SE2003
- SILCOTHERM 2 PART ADDITION CURE SILICONE ENCAPSULANT
- SE2005
- 2 PART CONDENSATION CURE SILICONE ENCAPSULANT
- SE2010
- SILCOTHERM 2 PART SILICONE GAP FILLER
- SE2011
- 2-PART SELF BONDING POTTING COMPOUND
- SE3000
- SILCOTHERM 2 PART ADDITION CURE LOW VISCOSITY
- SILCOSET 101
- 2 PART CONDENSATION CURE SILICONE ENCAPSULANT HIGH TEMPERATURE
- SILCOSET 105
- 2-PART CONDENSATION CURE SILICONE ENCAPSULANT
- SE3001
- SILCOTHERM 2 PART 2.54 W/MK SILICONE ENCAPSULANT
- SILSO CLEAR 21002
- 2 Part , Optical grade LSR !!